About SUN Corporation
About
About SUN Corporation
SUN Corporation, Ltd. (renamed from Fortrend Engineering (Hsinchu) Corporation, Ltd. in October 2024) was established in 2008. It is a semiconductor equipment research and development, manufacturing, sales and customer service product company with independent IP property rights. The company provides 3 major product lines: (1) SMIF production line fully automatic sealed box loading and unloading load ports and material control ID (IR and RFID) automation system; (2) high-precision dust-free wafer robot and equipment front-end automation system (EFEM/Sorter ); (3) High-temperature dust-free and oxygen-free wafer baking oven (thermal curing oven) and mass production automation integration system.
Products
PRODUCTS-
SIO-300-200 Series Low Temperature Vacuum Oven
Features
• The Oven system has integrated mini-environment, 300mm load ports, wafer robot, cassette robot, and oven and control unit.
• Field proven application: 3DIC baking, photo-resist baking, moist removal, reflow and thermal process.
• 200mm cassette manual/auto load available.
• 25 PCS of Wafer per cassette
• Wide operating range: ambient ~ 250 °C.
• Full automatic.
• Friendly operational interface.
• Class 10 for Baking Chamber. Better Class 10 for Oven System
• Process Gas Input: N2
• Nitrogen Consumption: 0~50L/min
• Temperature Uniformity: ± 3.5oC
• Number of Recipe: Programmable
• Wafer and robotic arm protrusion detection
• Main controller: IPC – Windows 10 or newer
• Modular design minimizes adjustments, maintenance and downtime
• Thermal Chamber complies SEMI S2 S8 standard
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FVO-450 Series High Temperature Vacuum Oven
Features
• Up to 300mm wafer capacity of 50 each chamber.
• Low O2 (Less than 10ppm over background)
• Continuous laminar flow of process gas parallel to wafer
• Removes aerosol particles released by thermal expansion
• Uniform gas environment around wafers improves film solvent evaporation and removal.
• Process Temperature Range Ambient +20~450℃
• Four Process Temperature Control Zone and Temperature Uniformity Better than ± 1℃ after Stabilization
• Maximum Heating Ramp 8℃/minute and Cooling Ramp 4℃/minute
• Process gas heated to process temperature before entering chamber.
• S2,S8 compliant
• Chamber Vacuum Exhaust
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200 / 300mm Wafer Sorter and EFEM
• 200mm/300mm wafers transfer
• Class 1 environment with integrated ionizers
• SECS/GEM capabilities
• Reliable performance using SUN field proven load port and robot
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LPT+ S
Features
• Less than 90-second cycle time maximizes production.
• Small footprint saves valuable FAB floor-space.
• Tilt and Straight end-effector meets special customer requirements.
• Adjustable loading height provides ergonomic efficiency.
• Built-in mini-environment and clean airflow system maintain Class 1 cleanliness.
• CE and S2S8 certification
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LPT+ Sx
Features
• Less than 90-second cycle time maximizes production.
• Small footprint saves valuable FAB floor-space.
• Tilt and Slide end effector meets special customer requirements.
• Adjustable loading height provides ergonomic efficiency.
• Built-in mini-environment and clean airflow system maintain Class 1 cleanliness.
• CE and S2S8 certification
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LPT+ R
Features
• Less than 90-second cycle time maximizes production.
• Small footprint saves valuable FAB floor-space.
• Rotating end effector meets special customer requirements.
• Adjustable loading height provides ergonomic efficiency.
• Built-in mini-environment and clean airflow system maintain Class 1 cleanliness.
• CE and S2S8 certification