About SUN Corporation

2026

Launch a 310 mm × 310 mm Panel Level Packaging(PLP) high-temperature vacuum oxygen-free baking system.

Launch the iVision series Vision Mapping products, addressing wafer breakage risks when robots pick up high-warpage wafers.

Launch 510 mm × 515 mm Panel Level Packaging(PLP) Robot, Load Port, and EFEM series products.

Launch a 510 mm × 515 mm Panel Level Packaging(PLP) high-temperature oxygen-free baking system.

2025

Launch the Lamina+ 310 mm × 310 mm Panel Level Packaging (PLP) EFEM series.

Launch a 100% in-house developed, third-generation 300 mm wafer high-cleanliness, high-temperature vacuum oxygen-free baking system (FVO-300-450 X3), with temperature control and automation specifications meeting top-tier international standards.

Introduced the high-efficiency HMJ robot, bringing the company's robot line to an international level.

Launch a 310 mm × 310 mm Panel Level Packaging (PLP) Load Port.

Launch a <10 ppm vacuum oxygen analyzer.

2024

Released the new Bravo series SCARA wafer handling robot.

Introduced the new LPT+ series Adaptive SMIF robots.

Released a fully electric 300mm FOUP opener.

Invited Malaysian public company Dufu Industries Sdn. Bhd. to invest in SMIF Automation, granting it exclusive distribution rights in Malaysia for joint Southeast Asia market expansion.

Fortrend Taiwan Engineering Corporation was renamed SUN Corporation.

2023

Launched the new UDC3 control system series, fully upgrading existing equipment hardware and GUI software.

2022

Established a wholly owned subsidiary, SMIF Automation Sdn. Bhd., in Malaysia to serve local customers and prepare for Southeast Asia market expansion.

2021

Received major SMIF automation system orders from Wolfspeed (USA) and OSRAM (Germany).

2018

Developed a custom E2000 EFEM for ASM (USA), successfully installed and operating at its Singapore site.

2017

Fortrend Taiwan Engineering Corporation became independent from Fortrend Engineering (USA) and established itself as a standalone company.

2016

Lamina EFEM collaborated with YES (USA) to co-develop a fully automated high-temperature vacuum baking system, winning a major order from a Taiwanese manufacturer with over 100 systems shipped within a year.

2013

Fortrend Taiwan Engineering Corporation acquired ICCI's high-temperature furnace tube control system and the Super-TMX software system in the USA, providing core after-sales components for furnace manufacturer Thermco.

2012

Fortrend Taiwan Engineering Corporation successfully launched its self-developed oven system and delivered it to a US-based company.

2009

Fortrend Taiwan Engineering Corporation launched the Lamina series EFEM/Sorter, which received stable orders from both domestic and international customers,  becoming the company's second core product. 

2008

Fortrend Engineering (USA) acquired Taiwan Fortrend Technology Co., Ltd.'s Hsinchu Semiconductor Division and established Fortrend Taiwan Engineering Corporation.

2005

Taiwan Fortrend Technology Co., Ltd. merged with a touchscreen panel R&D and manufacturing company in Linkou, with Taiwan Fortrend Technology Co., Ltd. remaining as the surviving company, established the Linkou Panel Business Unit.

2002

Taiwan Fortrend Technology Co., Ltd. launched its first 12-inch wafer-level baking system, which was successfully installed and operated at the customer site, followed by stable order intake.

2001

Taiwan Fortrend Technology Co., Ltd. independently developed the UDC series control system and completed its first self-designed 12-inch wafer front-end automation module (EFEM), successfully installed and operating at the customer site.

1999

Taiwan Fortrend Technology Co., Ltd. was established and received technology transfer from Fortrend Engineering (USA) to manufacture SMIF equipment.